AMD Ryzen 6000 processor: LGA CPU version based on Intel model


AMD would like to say goodbye to the so-called Pin Grid Arrays (PGAs) in desktop processors. The chipmaker uses this design from socket A for Athlon processors, where the motherboard contact pins are on the processor. Instead, the next AM5 platform must upgrade to a Land Grid Array (LGA). With LGA sockets, the CPU contact pins are located in the motherboard – processors only have gold contact surfaces. Thus, the processor pins can no longer bend, motherboards are more sensitive.

Intel has used this principle for generations. A metal frame with a lock presses the CPUs into the LGA sockets to ensure perfect contact. AMD has so far only used the LGA construction principle for the server series, more recently the LGA4096 for Epyc 7001, 7002 and 7003, and their offshoots of Ryzen Threadripper (Pro) workstations.

Plus point for LGA sockets with locks: Processors can no longer stick to the CPU cooler when removed if the thermal grease is cold and therefore acts as an adhesive.

“ExecutableFix” shows self-created render images via Twitterwhat the CPU AM5 version and early Zen 4 processors might look like. Heat sinks for waste heat distribution and for mechanical protection of silicon chips are expected to be high compared to previous Ryzen models. In this way, AMD creates space for stacked chips (3D stacking), which the chipmaker would like to test within the Ryzen 5000 family: With V-Cache, AMD’s cache dies directly on the compute chips in order to reach level 3 -Cache to increase up to 192MB.

Compared to AM4, AM5 with 1718 pins (LGA1718) should have 387 additional contacts. Videocardz summarizes the rumors that AMD wants to use the additional contacts for four additional PCI Express lanes, for example for a second M.2 SSD connected to the CPU. In addition, with AM5, the switch to DDR5 RAM is pending.


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